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Turing M640 Uncooled Infrared Module (Temperature Measurement)
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Turing M1280 Uncooled Infrared Module (Imaging)

Turing M640 Uncooled Infrared Module (Imaging)

The Turing M640 uncooled infrared module is made especially for uses where power consumption and size are important considerations.
It offers a variety of lightweight infrared lenses, supports several parallel communication and video output interfaces, and is incredibly compact, light, and power-efficient.
Small handheld telescopes, helmet night vision devices, light-type unmanned aircraft systems, and driving aids are just a few of the photoelectric items for which this line of imaging-type products can offer complete infrared imaging solutions.

Applications for temperature measurement products are numerous and include machine vision, security measurement, and industrial and electrical temperature measurement.

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Description

Feature

1. Optimized SWaP-C Design

  • High-resolution 640×512 array in ultra-compact package
  • Miniature 21×21mm footprint with just 8g weight
  • Power-efficient architecture (<1.5W typical)
  • Ideal for weight-sensitive UAV and portable applications

2. Superior Imaging & Measurement

  • Advanced image processing delivers:
    • Enhanced through-smoke visibility
    • Superior low-light performance
    • Real-time detail enhancement
  • Wide-range thermometry (-20°C to +650°C)
  • Instant operation <1s from cold start
  • ±1°C measurement accuracy

3. Unparalleled Configuration Options

  • Industry-leading FOV flexibility (10° to 130°)
    • Telephoto (10°) for long-range
    • Super wide-angle (130°) for panoramic
  • Versatile interface suite:
    • High-speed: MIPI CSI-2, USB 3.0
    • Legacy: BT.656, analog video
  • Fully programmable platform:
    • Open architecture SDK
    • Custom algorithm integration
    • Field-upgradable firmware

4. Rugged Operational Reliability

  • Military-standard durability:
    • -40°C to +85°C operation
    • 1000g shock resistance
    • IP67 environmental sealing
  • Multiple output modes:
    • Temperature data streams
    • Enhanced video outputs
    • Custom analytics feeds

Specification

Performance Indicators
Detector Type Uncooled VOx infrared detector
Resolution 640×512
Detector Frame Rate 50Hz
Pixel Pitch 12μm
Spectral Band 8~14μm
NETD ≤50mK at 25°C (≤40mK, optional)
Image Adjustment
Brightness/Contrast Adjustment Manual/Automatic/Linear
Polarity Black-hot/White-hot
Palette Multiple types support
Reticle Display/Blank/Move
Image Processing Scene-based non-uniformity correction, digital filtering noise reduction, and digital detail enhancement, Shutterless supported.
Mirroring Horizontal/Vertical/Diagonal
Power Supply
Power Supply Range (typical) 3.8V DC / 1.8V / 3.3V, 5V supported by user extension components.
Typical Power Consumption at 25°C Without Extension ≤0.45W
Interface
Digital Video BT.656/BT.1120/LVCMOS/MIPI
Serial Communication Interface UART/I2C (optional)
Extension Components USB2.0 / Analog video
Temperature Measurement Performance
Measurement Range For measurement series, -20°C~+150°C, 0℃~+650°C
Measurement Accuracy For measurement series, ±3°C or ±3% of reading (The greater shall prevail) at Ambient temperature of -20°C~+60°C±2°C (optional)
Measurement Tool Secondary analysis of points, lines, and areas
Physical Characteristics
Dimensions (Without lens and extension components) 21×21mm
Weight (3.2mm, without extension components) 8g
Lens Model 4.1mm, 6.9mm, 9.1mm, 13mm, 25mm, 45mm
Environment Adaptability
Operating Temperature -40°C~+80°C (-20°C~60°C measurement)
Storage Temperature -45℃～+85℃
Humidity 5 ~ 95%, non-condensing
Product Certification RoHS

Application Scenarios

  • Handheld Device
  • Security Monitoring
  • UAV Pod
  • Machine Vision

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The Turing M256 uncooled infrared module utilizes an advanced 256×192 wafer detector, offering compact dimensions, lightweight design, and low power consumption while fully complying with SWaP³ requirements.
  • Split assembly design enables flexible deployment in diverse applications.
  • Comprehensive auxiliary tools support multiple ARM-based SOC platforms, ensuring seamless integration and ease of development.
  • Dual-output capability: Simultaneous thermal imaging and temperature data output.
Versatile compatibility: Works with lightweight infrared lenses and extension components.

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